This machine uses third-order intracavity frequency doubling (THG) technology. Compared with infrared lasers, the 355nm ultraviolet light focusing spot is extremely small, which can greatly reduce the mechanical deformation of materials and the heat-affected zone during processing is negligible. Therefore, it is mainly used for ultra-fine marking and engraving, and is particularly suitable for marking and drilling micro-holes in food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.